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Wafer

Semiconductor wafer dry cleaning machine

Specifications

Wafer (Glass) Size & Thickness 12 Inch(Ø300mm) Wafer(0.7T), Glass(0.5T) Wafer, Glass simultaneously available
Cleaning Power 96~99% (Based on 3 ㎛ Spacers) ※ According to CTS standard particle
Nozzle standard Gap 1.5~2.0 mm
Moving type Stage moving
Power AC 208V 3P 60Hz
Wafer & Glass Supply By Robot