| Applications | All processes requiring sub-particle removal, Molded equipment parts and structured products |
|---|---|
| Distance when cleaning | Min 1.5mm ~ Max 15mm |
| Features | Consistent nozzle rotation, Collecting debris with powerful dust collector, Modularization in steps available per 100mm unit |
| Size of residues 100nm~ (Nano class range) | Cleaning power 90% |
|---|---|
| Size of residues 1.6nm~ | Cleaning power 99% |
| MCF module method | MCM(Metal Contact Free) method does not generate oil or metallic foreign substances |
